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Plasma Analysis Software Product List

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Particle-based Plasma Analysis Software 'Particle-PLUS'

Particle-based Plasma Analysis Software 'Particle-PLUS'

"Particle-PLUS" is a plasma analysis software suitable for simulations such as plasma reaction furnaces and chemical vapor deposition (CVD).

Particle-PLUS is a plasma and rarefied fluid analysis software that uses the particle method. It is effective for research, development, and manufacturing of devices and materials using plasma. It is also capable of analyzing advanced physical models such as dual-frequency CCP and external circuit models. With comprehensive support, even those new to simulation or busy with experiments can reliably achieve results. The software employs a particle model to analyze plasma, using the PIC/MC (Particle In Cell / Monte Carlo) method to track the motion of particles representing electrons and ions. Additionally, depending on the target plasma density, it efficiently switches between implicit methods for relatively high densities and explicit methods for low densities, allowing for effective solutions even with complex models. It excels in plasma simulations of low-pressure gases, where fluid modeling is particularly challenging. In addition to standard functions for CCP, ICP, and magnetron sputtering calculations, customization to fit the customer's equipment is also available.

  • Other analyses

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High-speed general-purpose plasma analysis software 'VizGlow'

High-speed general-purpose plasma analysis software 'VizGlow'

This software was developed by Professor Raja, an expert in plasma simulation at the University of Texas at Austin.

VizGlow is a general-purpose plasma simulation software developed by Esgee Technologies, Inc., founded by Professor Raja from the University of Texas at Austin, an expert in plasma simulation.

  • simulator
  • Contract Analysis
  • Analysis Services

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[Example] 'Particle-PLUS' RF Magnetron Sputtering

[Example] 'Particle-PLUS' RF Magnetron Sputtering

An example of the 'Particle-PLUS' analysis of RF magnetron sputtering, which is one of the film formation methods for dielectric films using process plasma.

"Particle-PLUS" is a simulation software suitable for research, development, and manufacturing of devices and materials using plasma. - It specializes in plasma analysis within vacuum chambers and can perform simulations of deposition rates at high speeds. - It excels in low-pressure plasma analysis. - It is proficient in plasma simulations of low-pressure gases, where calculations using fluid models are challenging. - It supports both 2D and 3D, allowing for efficient analysis even with complex models. - As a strength of our in-house developed software, customization to fit the customer's equipment is also possible. ◆ Supports various applications ◆ - Magnetron sputtering - PVD, plasma CVD - Capacitive coupled plasma (CCP) - Dielectric barrier discharge (DBD) - Electrophoresis, etc. ◆ Outputs various calculation results ◆ - Potential distribution - Density distribution/temperature distribution/generation distribution of electrons and ions - Particle flux and energy flux to the walls - Energy spectrum of electrons and ions at the walls - Density distribution/temperature distribution/velocity distribution of neutral gas, etc. *For more details, please feel free to contact us.

  • Other analyses

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[Example] Particle-PLUS DC Magnetron Sputter 3D

[Example] Particle-PLUS DC Magnetron Sputter 3D

"Particle-PLUS" specializes in plasma analysis within vacuum chambers and can quickly perform simulations such as film deposition rates.

"Particle-PLUS" is a simulation software suitable for research, development, and manufacturing of devices and materials using plasma. - It specializes in low-pressure plasma analysis. - By combining axisymmetric models with mirror-symmetric boundary conditions, it can quickly obtain results without the need for full device simulations. - It excels in plasma simulations for low-pressure gases, where calculations with fluid models are challenging. - It supports both 2D and 3D, allowing efficient analysis even for complex models. - As a strength of our in-house developed software, customization to fit the customer's equipment is also possible. ◆ Supports various applications ◆ - Magnetron sputtering - PVD, plasma CVD - Capacitive coupled plasma (CCP) - Dielectric barrier discharge (DBD) - Electrophoresis, etc. ◆ Outputs various calculation results ◆ - Potential distribution - Density distribution/temperature distribution/generation distribution of electrons and ions - Particle flux and energy flux to the walls - Energy spectrum of electrons and ions at the walls - Density distribution/temperature distribution/velocity distribution of neutral gas, etc. *For more details, please feel free to contact us.

  • Other analyses

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[Example] Particle-PLUS AC Magnetron Sputtering

[Example] Particle-PLUS AC Magnetron Sputtering

Introduction of analysis examples using "Particle-PLUS": "AC Magnetron Sputtering Simulation"

"Particle-PLUS" is a simulation software suitable for research, development, and manufacturing of devices and materials using plasma. - It specializes in low-pressure plasma analysis. - By combining axisymmetric models with mirror-symmetric boundary conditions, it can quickly obtain results without the need for full device simulations. - It excels in plasma simulations for low-pressure gases, where calculations using fluid models are challenging. - It supports 2D (two-dimensional) and 3D (three-dimensional) analyses, allowing for efficient analysis of complex models. - As a strength of our in-house developed software, customization to fit the customer's equipment is also possible. ◆ Supports various applications ◆ - Magnetron sputtering - PVD, plasma CVD - Capacitively coupled plasma (CCP) - Dielectric barrier discharge (DBD) - Electrophoresis, etc. ◆ Outputs various calculation results ◆ - Potential distribution - Density distribution/temperature distribution/generation distribution of electrons and ions - Particle flux and energy flux to the wall - Energy spectrum of electrons and ions at the wall - Density distribution/temperature distribution/velocity distribution of neutral gas, etc. *For more details, please feel free to contact us.

  • Other analyses

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[Case Study] 3D Analysis of the "Particle-PLUS" CCP Device

[Case Study] 3D Analysis of the "Particle-PLUS" CCP Device

Introduction to Particle-PLUS Analysis Case: "Three-Dimensional Analysis of Capacitively Coupled Plasma (CCP)" Simulation Case

"Particle-PLUS" is a simulation software suitable for the research, development, and manufacturing of devices and materials using plasma. - It specializes in low-pressure plasma analysis. - By combining axisymmetric models with mirror-symmetric boundary conditions, it can quickly obtain results without the need for a full simulation of the entire device. - It excels in plasma simulation for low-pressure gases, where calculations using fluid models are challenging. - It supports 2D (two-dimensional) and 3D (three-dimensional) analyses, allowing for efficient analysis of complex models. - As a strength of our in-house developed software, customization to fit the customer's device is also possible. ◆ Supports various cases ◆ - Magnetron sputtering - PVD, plasma CVD - Capacitively coupled plasma (CCP) - Dielectric barrier discharge (DBD) - Electrophoresis, etc. ◆ Outputs various calculation results ◆ - Potential distribution - Density distribution/temperature distribution/generation distribution of electrons and ions - Particle flux and energy flux to the wall - Energy spectrum of electrons and ions at the wall - Density distribution/temperature distribution/velocity distribution of neutral gas, etc. *For more details, please feel free to contact us.

  • Other analyses

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[Case Study] Plasma Analysis of "Particle-PLUS" Dual Frequency CCP

[Case Study] Plasma Analysis of "Particle-PLUS" Dual Frequency CCP

Introduction to Particle-PLUS Analysis Case: "Plasma Analysis of Dual Frequency CCP" Simulation Case

This is a case study on plasma analysis of CCP (Capacitively Coupled Plasma) devices. Particle-PLUS specializes in plasma analysis within vacuum chambers and can perform high-speed simulations even when there are multiple electrodes or when applying overlapping frequencies. ◇ Features of 'Particle-PLUS' - Excels in low-pressure plasma analysis. - By combining axisymmetric models with mirror-symmetric boundary conditions, it can quickly obtain results without the need for full device simulations. - Specializes in plasma simulations for low-pressure gases, where fluid modeling is challenging. - Supports 2D (two-dimensional) and 3D (three-dimensional) analyses, efficiently handling complex models. - As a strength of our in-house developed software, customization to fit customer devices is also possible. ◆ Various calculation results can be output ◆ - Potential distribution - Density distribution/temperature distribution/generation distribution of electrons and ions - Particle flux and energy flux to the walls - Energy spectrum of electrons and ions at the walls - Density distribution/temperature distribution/velocity distribution of neutral gas and more. *For more details, please feel free to contact us.

  • Other analyses

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[Case Study] Cleaning Process Using Particle-PLUS: CCP

[Case Study] Cleaning Process Using Particle-PLUS: CCP

Introduction of Particle-PLUS Analysis Case: "Cleaning Process by CCP" Simulation Case

This is an analysis case regarding CCP (Capacitively Coupled Plasma) etching, which is one of the representative dry etching methods. Particle-PLUS specializes in plasma analysis within vacuum chambers and can perform simulations of etching rates and other parameters at high speed. ◇ Features of 'Particle-PLUS' - Excels in low-pressure plasma analysis. - By combining axisymmetric models with mirror-symmetric boundary conditions, results can be obtained quickly without the need for full device simulations. - Specializes in plasma simulations for low-pressure gases, where fluid modeling is challenging. - Supports both 2D and 3D, allowing for efficient analysis even with complex models. - As a strength of our in-house developed software, customization to fit customer devices is also possible. ◆ Various calculation results can be output ◆ - Potential distribution - Density distribution/temperature distribution/generation distribution of electrons and ions - Particle flux and energy flux to the walls - Energy spectrum of electrons and ions at the walls - Density distribution/temperature distribution/velocity distribution of neutral gas and more. *For more details, please feel free to contact us.

  • Other analyses

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Example: Particle-PLUS: GEC-CCP Device Plasma Analysis

Example: Particle-PLUS: GEC-CCP Device Plasma Analysis

Introduction to Particle-PLUS Analysis Case: "Plasma Analysis of GEC-CCP Device" 3D Simulation Case

This is a 3D analysis case related to CCP (Capacitively Coupled Plasma) etching, which is one of the representative dry etching methods. Particle-PLUS specializes in plasma analysis within vacuum chambers and can perform simulations of etching rates and other parameters at high speed. ◇ Features of 'Particle-PLUS' - Excels in low-pressure plasma analysis. - By combining axisymmetric models with mirror-symmetric boundary conditions, it can obtain results quickly without the need for full device simulations. - Specializes in plasma simulations for low-pressure gases, where fluid modeling is challenging. - Supports both 2D and 3D, allowing efficient analysis even for complex models. - As a strength of our in-house developed software, customization to fit customer devices is also possible. ◆ Outputs various calculation results ◆ - Potential distribution - Density distribution/temperature distribution/generation distribution of electrons and ions - Particle flux and energy flux to the walls - Energy spectrum of electrons and ions at the walls - Density distribution/temperature distribution/velocity distribution of neutral gas and more. *For more details, please feel free to contact us.

  • Other analyses

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[Example] Particle-PLUS: 3D Opposing Target Type Putter

[Example] Particle-PLUS: 3D Opposing Target Type Putter

Introduction to Particle-PLUS Analysis Case: "Counter Target Type Putter (3D Analysis)" Simulation Case

This is an analysis case of a counter-target sputtering method, which is one of the film deposition techniques that causes low damage to the substrate. 3D calculations have a higher computational cost compared to 2D calculations, but they allow for simulations that take into account more complex shapes and their effects. ◇ Features of 'Particle-PLUS' - Specializes in low-pressure plasma analysis. - By combining axisymmetric models with mirror-symmetric boundary conditions, results can be obtained quickly without the need to simulate the entire device. - Excels in plasma simulations in low-pressure gases, where calculations using fluid models are challenging. - Supports both 2D and 3D, allowing for efficient analysis even with complex models. - As a strength of our in-house developed software, customization to fit the customer's equipment is also possible. ◆ Various calculation results can be output ◆ - Potential distribution - Density distribution/temperature distribution/generation distribution of electrons and ions - Particle flux and energy flux to the walls - Energy spectrum of electrons and ions at the walls - Density distribution/temperature distribution/velocity distribution of neutral gas and more. *Please feel free to contact us for more details.

  • Other analyses

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[Case Study] Analysis of DLC Film Formation by Filtered Arc Deposition Method

[Case Study] Analysis of DLC Film Formation by Filtered Arc Deposition Method

Customization to fit your equipment is also possible! Efficient analysis even for complex models.

"Particle-PLUS" is a simulation software suitable for research, development, and manufacturing of devices, materials, and systems using plasma. It allows for fast results without the need to simulate the entire device by combining axisymmetric models and mirror-symmetric boundary conditions. It supports both 2D (two-dimensional) and 3D (three-dimensional) analyses, enabling efficient analysis even for complex models. 【Features】 ■ Specializes in low-pressure plasma analysis ■ Allows for fast results without the need to simulate the entire device by combining axisymmetric models and mirror-symmetric boundary conditions ■ Excels in plasma simulation for low-pressure gases, which are difficult to compute with fluid models ■ Supports both 2D (two-dimensional) and 3D (three-dimensional) analyses, enabling efficient analysis even for complex models ■ Customization to fit customer devices is possible as a strength of in-house developed software *For more details, please refer to the PDF document or feel free to contact us.

  • Software (middle, driver, security, etc.)

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[Case Study] Magnetron Sputtering Simulation

[Case Study] Magnetron Sputtering Simulation

By utilizing the particle method plasma analysis software Particle-PLUS, the behavior of atoms within the magnetron sputtering device is simulated.

Particle-PLUS is an excellent simulation software for numerical analysis of non-equilibrium plasma generated in rarefied gases. It can be utilized in applications such as magnetron sputtering, PVD, plasma CVD, capacitively coupled plasma (CCP), and dielectric barrier discharge (DBD). By utilizing the sputtered particle module among various modules (refer to the product description below), it is possible to determine the behavior of atoms sputtered from the target in plasma and neutral gas in magnetron sputtering devices, allowing for quick evaluation of flux distribution on opposing substrates. The analysis procedure involves using the particle and energy flux of the plasma obtained from the plasma module to determine the generation distribution and amount of sputtered particles, and tracking their motion using a particle method known as the test particle method.

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[Example] Particle-PLUS Opposing Target Sputtering

[Example] Particle-PLUS Opposing Target Sputtering

Introduction of analysis examples using "Particle-PLUS": "Opposing Target Sputtering"

"Particle-PLUS" is a simulation software suitable for the research, development, and manufacturing of devices and materials using plasma. - It specializes in low-pressure plasma analysis. - By combining axisymmetric models with mirror-symmetric boundary conditions, it can quickly obtain results without the need for full device simulations. - It excels in plasma simulations for low-pressure gases, where calculations with fluid models are challenging. - It supports both 2D and 3D, allowing for efficient analysis of complex models. - As a strength of our in-house developed software, customization to fit the customer's device is also possible. ◆ Supports various applications ◆ - Magnetron sputtering - PVD, plasma CVD - Capacitively coupled plasma (CCP) - Dielectric barrier discharge (DBD) - Electrophoresis, etc. ◆ Outputs various calculation results ◆ - Potential distribution - Density distribution/temperature distribution/generation distribution of electrons and ions - Particle flux and energy flux to the wall - Energy spectrum of electrons and ions at the wall - Density distribution/temperature distribution/velocity distribution of neutral gas, etc. *For more details, please feel free to contact us.

  • Other analyses

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[Example] "Particle-PLUS" Counter Target Type Sputtering

[Example] "Particle-PLUS" Counter Target Type Sputtering

Introduction of Particle-PLUS Analysis Case: "Simulation Case of Al Thin Film Fabrication Using Face-to-Face Target"

"Particle-PLUS" is a simulation software suitable for research, development, and manufacturing of devices and materials using plasma. - It specializes in low-pressure plasma analysis. - By combining axisymmetric models with mirror-symmetric boundary conditions, it can quickly obtain results without the need for simulations of the entire device. - It excels in plasma simulations for low-pressure gases, where calculations using fluid models are challenging. - It supports both 2D and 3D, allowing for efficient analysis of complex models. - As a strength of our in-house developed software, customization to fit the customer's device is also possible. ◆ Supports various cases ◆ - Magnetron sputtering - PVD, plasma CVD - Capacitively coupled plasma (CCP) - Dielectric barrier discharge (DBD) - Electrophoresis, etc. ◆ Outputs various calculation results ◆ - Potential distribution - Electron and ion density distribution/temperature distribution/generation distribution - Particle flux and energy flux to the wall - Energy spectrum of electrons and ions at the wall - Neutral gas density distribution/temperature distribution/velocity distribution, etc. *For more details, please feel free to contact us.

  • Other analyses

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[Example] Mass analysis of the "Particle-PLUS" ion beam.

[Example] Mass analysis of the "Particle-PLUS" ion beam.

Introduction to Particle-PLUS Analysis Case: "Ion Beam Mass Analysis and Electrostatic Acceleration" Simulation Case

"Particle-PLUS" is a simulation software suitable for research, development, and manufacturing of devices and materials using plasma. - It excels in low-pressure plasma analysis. - By combining axisymmetric models and mirror-symmetric boundary conditions, it can quickly obtain results without the need for full device simulations. - It specializes in plasma simulations in low-pressure gases, where calculations with fluid models are challenging. - It supports 2D (two-dimensional) and 3D (three-dimensional) analyses, allowing efficient analysis of complex models. - As a strength of our in-house developed software, customization to fit the customer's equipment is also possible. ◆ Supports various cases ◆ - Magnetron sputtering - PVD, plasma CVD - Capacitively coupled plasma (CCP) - Dielectric barrier discharge (DBD) - Electrophoresis, etc. ◆ Outputs various calculation results ◆ - Potential distribution - Density distribution/temperature distribution/generation distribution of electrons and ions - Particle flux and energy flux to the wall - Energy spectrum of electrons and ions at the wall - Density distribution/temperature distribution/velocity distribution of neutral gas, etc. *For more details, please feel free to contact us.

  • Other analyses

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